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Product Description |
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Ultrason E 2010 is an unreinforced, medium viscosity standard
injection molding PES grade. Ultrason E 2010 Natural flows readily
and offers outstanding heat resistance and dimensional
stability. |
Applications |
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Typical applications include automotive applications such as
fuse encapsulation, connectors, heating system and headlight
components and household applications such as microwave dishes,
baby bottles and other applications requiring high heat
resistance. |
PHYSICAL |
ISO Test Method |
Property Value |
Density, g/cm� |
1183 |
1.37 |
Mold Shrinkage, parallel, % |
294-4 |
0.82 |
Mold Shrinkage, normal, % |
294-4 |
0.86 |
Moisture, % |
62 |
|
(50% RH) |
|
0.8 |
(Saturation) |
|
2.2 |
RHEOLOGICAL |
ISO Test Method |
Property Value |
Melt Volume Rate (360 癈/10 Kg), cc/10min. |
1133 |
70 |
MECHANICAL |
ISO Test Method |
Property Value |
Tensile Modulus, MPa |
527 |
|
23癈 |
|
2,700 |
Tensile stress at yield, MPa |
527 |
|
23癈 |
|
90 |
Tensile strain at yield, % |
527 |
|
23癈 |
|
6.7 |
Ball Indentation, MPa |
2039-1 |
154 |
Tensile Creep Modulus (1000h), MPa |
899 |
2,700 |
IMPACT |
ISO Test Method |
Property Value |
Izod Notched Impact, kJ/m2 |
180 |
|
23癈 |
|
6.5 |
Charpy Notched, kJ/m2 |
179 |
|
23癈 |
|
6.5 |
-30癈 |
|
7 |
Charpy Unnotched, kJ/m2 |
179 |
|
23癈 |
|
N |
-30癈 |
|
N |
THERMAL |
ISO Test Method |
Property Value |
HDT A, � C |
75 |
205 |
Coef. of Linear Thermal Expansion, Parallel, mm/mm
癈 |
|
0.52 X10-4 |
ELECTRICAL |
ISO Test Method |
Property Value |
Comparative Tracking Index |
IEC 60112 |
125 |
Volume Resistivity |
IEC 60093 |
>1E13 |
Surface Resistivity |
IEC 60093 |
>1E14 |
Dielectric Constant (100 Hz) |
IEC 60250 |
3.9 |
Dielectric Constant (1 MHz) |
IEC 60250 |
3.8 |
Dissipation Factor (100 Hz) |
IEC 60250 |
17 |
Dissipation Factor (1 MHz) |
IEC 60250 |
140 |
Dielectric Strength, KV/mm |
IEC 60243-1 |
37 |
UL RATINGS |
UL Test Method |
Property Value |
Flammability Rating, 1.5mm |
UL94 |
V-0 |
Relative Temperature Index, 1.5mm |
UL746B |
|
Mechanical w/o Impact, 癈 |
|
190 |
Mechanical w/ Impact, 癈 |
|
180 |
Electrical, 癈 |
|
180 |
Processing Guidelines |
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Material Handling Max. Water content: 0.02%
Ultrason pellets can absorb moisture very rapidly and must be dried
before processing. A vacuum or dry air oven operating at 130-150
degC (266-302 degF) is recommended. Circulating air ovens are
unsuitable. Drying time is dependent on moisture level, but the
materials must be dried at least 4 hours. Further information
concerning safe handling procedures can be obtained from the
Material Safety Data Sheet. Alternatively, please contact your BASF
representative. Typical Profile Melt Temperature
340-390 degC (644-734 degF) Mold Temperature 140-180 degC (284-356
degF) Injection and Packing Pressure 35-125 bar (500-1500 psi)
Mold Temperatures Injection pressure controls the
filling of the part and should be applied for 90% of ram travel.
Packing pressure affects the final part and can be used effectively
in controlling sink marks and shrinkage. It should be applied and
maintained until the gate area is completely frozen off. Back
pressure can be utilized to provide uniform melt consistency and
reduce trapped air and gas. Minimal back pressure should be
utilized to prevent glass breakage. Pressures Fast
fill rates are recommended to ensure uniform melt delivery to the
cavity and prevent premature freezing. Surface appearance is
directly affected by injection rate. |
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