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Almost all of the new sputtering equipment use strong magnets to move electrons into a spiral to accelerate the ionization of argon around the target, resulting in an increase in the probability of impact between the target and argon ions and improve the sputtering rate.
Generally, DC sputtering is used for metal coating, while RF AC sputtering is used for non-conductive ceramic materials. The basic principle is to use glow discharge (glow discharge) to hit argon (Ar) ions on the surface of target (target) in vacuum, and the cations in the plasma will accelerate to the negative electrode surface of the spattered material. This impact will make the material of the target fly out and deposit on the surface of the target.
A thin film is formed on the substrate.
Generally speaking, there are several characteristics of sputtering coating:
(1) metal, alloy or insulator can be made into thin film material.
(2) the film with the same composition can be made from multiple and complex targets under appropriate setting conditions.
(3) the mixture or compound of target material and gas molecule can be made by adding oxygen or other active gas to the discharge
atmosphere.
(4) the input current and sputtering time of the target can be controlled, and the high precision film thickness can be easily obtained.
(5) it is more advantageous to produce large area uniform film than other processes.
(6) the sputtered particles are almost not affected by gravity, and the positions of the target and the substrate can be arranged freely.
(7) the adhesion strength between the substrate and the film is more than 10 times that of the general evaporated film, and because the sputtered particles have high energy, the film will continue to diffuse on the film-forming surface to obtain a hard and dense thin film. At the same time, this high energy makes the substrate as long as the lower temperature to get the crystalline film.
(8) the nucleation density of the film is high at the initial stage of its formation, and the ultra-thin continuous film below 10nm can be produced.
(9) the target has a long life and can be produced automatically and continuously for a long time.
(10) the target can be made into various shapes, which can be better controlled and efficient with the special design of the machine.
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